Shenzhen International Automotive Semiconductor Technology Summit Forum 2024

Background

In order to strengthen domestic and international exchanges and cooperation, promote collaborative innovation in the industrial chain, break 

through key core technologies, accelerate the application of technological products, and promote high-quality development of the automotive 

semiconductor industry, the "2024 Shenzhen International Automotive Semiconductor Technology Summit Forum" hosted by Asia New Energy 

Vehicle Network will be grandly held on September 2, 2024 at the Shenzhen Convention and Exhibition Center. This forum assists enterprises in 

brand exposure, new product releases, and maintaining supplier relationships. It is a high-quality platform for industry buyers and professionals 

to obtain the latest market information, cutting-edge technology, and learn from international leading experts. At that time, we welcome colleagues 

from various industries to come to the scene and discuss new trends in industry development together.

Organization

Organizer: Asia New Energy Vehicle Network

Undertaking unit: Shenzhen Owl Information Technology Co., Ltd

Official media: Asia New Energy Vehicle Network, Asia New Energy Vehicle Network WeChat platform

Highlights

① Elite gathering together to promote industrial exchange between upper and lower levels

② Expert's wonderful sharing, focusing on the development of professional fields

③ Research results release, creating an open platform for cooperation

④ Procurement visits the site and builds a procurement docking platform

⑤ Media tracking and reporting to expand industry brand influence

Invited participating companies (proposed)

Automotive host manufacturers, Tier One, intelligent cockpit enterprises, navigation enterprises, vehicle networking technology enterprises, 

automotive instrument enterprises, autonomous driving enterprises, radar enterprises, artificial intelligence (AI) enterprises, display panel 

enterprises, autonomous driving chip enterprises, body control chip enterprises, intelligent cockpit chip enterprises, auxiliary driving chip 

enterprises, silicon wafer enterprises, photoresist enterprises, sputtering target material enterprises, packaging material enterprises, chip 

design enterprises Wafer foundry enterprises, packaging and testing enterprises, as well as related materials and equipment, research institutes, etc.